Texas Instruments Expands Chip Manufacturing with Two New Fabs in Texas

Texas Instruments

Texas Instruments Expands Domestic Semiconductor Capacity

Texas Instruments (TI) will build two new semiconductor fabrication facilities in Sherman, Texas, as part of its $60bn investment plan. The company aims to strengthen domestic semiconductor production amid rising demand and strategic US policy support. These facilities will join seven other fabs already operating or planned across Texas and Utah, collectively expected to produce hundreds of millions of chips daily at full capacity.

Federal Support Boosts Semiconductor Manufacturing Investment

The US government is playing a central role in enabling TI’s semiconductor expansion. In 2024, TI secured $1.6bn under the US Chips and Science Act to support construction of its first two Sherman fabs and its second Lehi, Utah, facility. The company also expects $6bn–8bn in additional tax credit funding from the US Treasury Department’s advanced manufacturing investment program. If Congress raises the investment credit percentage from 25pc to 30pc, TI could gain further support for its projects.

Broader Impact on Semiconductor Supply Chains

TI’s semiconductor fabs will play a crucial role in securing critical supply chains for US industries. The company produces analog and embedded processing semiconductors for major customers such as Apple, Ford, Medtronic, Nvidia, and SpaceX. By expanding capacity, TI will help reduce reliance on foreign semiconductor sources, strengthen resilience against supply shocks, and enhance competitiveness across technology and automotive markets.

The Metalnomist Commentary

Texas Instruments’ expansion reflects the reshaping of global semiconductor supply chains under US industrial policy. While the $60bn investment is significant, its real impact lies in reducing import dependency and fortifying key technology sectors. The fabs will strengthen US capabilities in advanced manufacturing, ensuring long-term resilience in a geopolitically sensitive industry.

Texas Instruments Secures $1.6 Billion in CHIPS Act Funding for Semiconductor Expansion

Texas Instruments

The U.S. Department of Commerce has awarded $1.6 billion to Texas Instruments under the CHIPS and Science Act, supporting the construction of two semiconductor fabrication plants in Sherman, Texas, and one in Lehi, Utah. This funding is part of the U.S. government’s push to strengthen domestic semiconductor production and reduce reliance on foreign supply chains.

Texas Instruments is currently building three large-scale 300mm wafer fabrication facilities, all of which are set to operate using 100% renewable electricity by 2027. The Sherman facilities are expected to commence operations in 2025, while the Utah facility is scheduled to begin production in 2026.

Additional Federal Incentives Expected

Beyond the CHIPS Act funding, Texas Instruments anticipates an additional $6 billion to $8 billion in funding from the U.S. Treasury Department's Investment Tax Credit, which supports manufacturing investments under the federal initiative.

These investments align with the Biden administration’s semiconductor strategy, aiming to enhance domestic chip production, support clean energy initiatives, and boost national security in the semiconductor supply chain.

TI Silicon Labs Acquisition Signals a Bigger Push in US Semiconductor Reshoring

Texas Instruments

The TI Silicon Labs acquisition marks a major move in the US semiconductor sector. Texas Instruments plans to acquire Silicon Labs in a deal worth about $7.5bn. The transaction would add a large wireless connectivity portfolio to TI’s business. As a result, the TI Silicon Labs acquisition could strengthen both product scale and domestic manufacturing control.

This deal matters because Silicon Labs brings around 1,200 embedded wireless connectivity products. Those products fit closely with TI’s broader semiconductor footprint. Management said the portfolio integrates well with TI’s manufacturing strategy. Therefore, the TI Silicon Labs acquisition looks like a capacity and product expansion move at the same time.

The industrial message is also clear. TI plans to reshore Silicon Labs manufacturing from overseas foundries. That gives the company more direct control over production, supply security, and long-term cost structure. Consequently, the TI Silicon Labs acquisition supports a wider US semiconductor reshoring trend.

US Semiconductor Reshoring Gains More Strategic Weight

US semiconductor reshoring is becoming a bigger part of TI’s long-term strategy. The company already operates three 300mm wafer fabs in the United States. Two are in Texas and one is in Utah. As a result, TI has a strong domestic production base to absorb future expansion.

The company is also planning more capacity. TI intends to build two additional 300mm fabs in Texas under its $60bn domestic investment plan. That means the Silicon Labs acquisition would sit inside a much larger manufacturing agenda. Therefore, US semiconductor reshoring is not a side theme here. It is central to the deal’s logic.

This matters for supply chains as well. Companies want more stable access to chips used in communications, industrial systems, and connected devices. Domestic manufacturing offers better visibility during geopolitical or logistics disruption. Meanwhile, reshoring can improve alignment between product design and production strategy.

300mm Wafer Fabs and Wireless Products Create a Stronger TI Platform

300mm wafer fabs give TI a meaningful advantage in scale and manufacturing efficiency. Adding Silicon Labs could let TI connect that production strength with a deeper wireless product offering. That combination could be especially valuable in industrial and embedded markets. Consequently, the TI Silicon Labs acquisition may improve both reach and operating leverage.

The transaction structure also shows confidence. TI expects to fund the deal with cash and debt financing. The companies expect the acquisition to close in the first half of 2027, subject to shareholder approval. Therefore, the market now has a clearer timeline for how this strategy may unfold.

The broader takeaway is important. This is not only a portfolio expansion. It is also a bet that domestic semiconductor manufacturing and wireless connectivity will matter more together in the years ahead. As a result, the TI Silicon Labs acquisition may become a notable example of how product strategy and reshoring strategy are starting to merge.

The Metalnomist Commentary

This deal stands out because it combines technology breadth with manufacturing intent. TI is not just buying wireless products. It is using the acquisition to reinforce a longer-term US semiconductor reshoring strategy built around scale, control, and domestic capacity.