GaN-on-Silicon RF Chips Enter Mass Production as China Expands 6G Supply Chain

CETC

GaN-on-silicon RF chips have entered large-scale commercial production in China after state-owned China Electronics Technology Group delivered more than 5mn units for smart terminal applications. CETC described the product as the world's first commercially mass-produced GaN-on-silicon radio-frequency chip for this market.

GaN-on-silicon RF chips combine the high-frequency and high-power advantages of gallium nitride with the lower cost and manufacturing scale of silicon substrates. That combination could make the technology increasingly attractive for next-generation communications equipment.

GaN-on-silicon RF chips are expected to support high-speed connectivity across integrated space-air-ground communication networks. These systems are becoming important for 6G, commercial aerospace, low-altitude aviation and emergency communications.

The development also strengthens the long-term demand outlook for gallium. As GaN semiconductor production expands, high-purity gallium and advanced processing capacity become increasingly important parts of the electronics supply chain.

6G and Aerospace Drive Demand for High-Performance RF Chips

RF power amplifiers are critical to wireless communications because they influence transmission power, data speeds, coverage and network stability.

GaN offers advantages over conventional semiconductor materials in high-frequency and high-power applications. This makes the material well suited to communications infrastructure, radar, satellites and other demanding electronic systems.

China's 6G development, commercial aerospace sector and low-altitude economy are all expanding. These industries require more RF components capable of operating efficiently at higher frequencies and power levels.

Space-air-ground networks could become a particularly important market. These systems combine satellites, aircraft, terrestrial networks and smart terminals to provide continuous communications coverage.

Lower-cost GaN-on-silicon technology could make such systems easier to deploy at scale. Silicon substrates can also provide a more established manufacturing route than some alternative compound semiconductor platforms.

Mass production therefore matters as much as technical performance. Moving GaN technology from specialised applications into millions of commercial devices represents an important step toward broader adoption.

Gallium Moves Further Down the Semiconductor Value Chain

The expansion of GaN chip manufacturing has direct implications for gallium demand. GaN production requires highly refined gallium that meets stringent semiconductor purity requirements.

This increases the value of processing and refining capacity further upstream. Gallium supply is not only about producing primary metal but also about converting it into materials suitable for semiconductor manufacturing.

China already occupies a dominant position in global gallium supply and has placed the metal under dual-use export controls since 2023. That gives gallium growing strategic importance in both semiconductor and defence supply chains.

Greater domestic GaN production could absorb more high-purity gallium inside China, reducing the amount available for export depending on market conditions and policy.

For overseas semiconductor manufacturers, this reinforces the need to diversify gallium sourcing and processing. Demand growth from 6G, aerospace, radar and power electronics could tighten the market even without major changes in primary production.

The broader industrial trend is clear. Gallium is moving from a niche minor metal toward a strategically important input for multiple advanced technology platforms.

The Metalnomist Commentary

CETC's mass delivery shows that GaN is moving from specialised defence and telecom applications into commercial-scale electronics. The strategic bottleneck may increasingly shift upstream to high-purity gallium and qualified semiconductor materials rather than chip design alone.