India Semiconductor Mission chip-making projects win $525mn boost across four states

3D Glass Solutions

India Semiconductor Mission chip-making projects secured $525mn to accelerate domestic fabs and advanced packaging. The India Semiconductor Mission chip-making projects include SiCSem, 3D Glass Solutions, CDIL and ASIP Technologies. As a result, the India Semiconductor Mission chip-making projects aim to reduce import dependence and strengthen critical electronics supply chains.

What the approvals deliver

India approved four projects with Rs46bn in funding. The total ISM portfolio now spans 10 projects across six states. Combined committed investment reaches about Rs1.60 trillion. Production is expected within two to three years, the ministry said.

Who is building what

SiCSem will build India’s first commercial compound-semiconductor fab in Odisha. It will make silicon-carbide devices for EVs, rail, defence and power electronics. Planned output targets 60,000 wafers and 96mn packaged units each year.

3DGS will localize advanced packaging and 3DHI in Odisha. Its line includes glass interposers, silicon bridges and heterogeneous integration modules. Nameplate capacity is 69,600 glass panels, 50mn assembled units and 13,200 3DHI modules.

ASIP Technologies, with Korea’s APACT, will add high-volume packaging in Andhra Pradesh. The plant targets 96mn packaged units annually for mobile and automotive. CDIL in Mohali will produce 158mn high-power devices and transistors each year.

Why this matters for supply chains

These investments lift local content in telecom, automotive and industrial electronics. Meanwhile, they complement India’s expanding chip-design ecosystem. Therefore, OEMs gain shorter lead times, resilient sourcing and tariff insulation.

Advanced nodes are not the near-term goal here. However, power devices and advanced packaging unlock fast manufacturing wins. As a result, India moves up the value chain while training a skilled workforce.

The Metalnomist Commentary

India is prioritizing power semiconductors and packaging where capex and time-to-market are favorable. The next milestone is execution: tool delivery, yield ramps and stable utilities. Watch for anchor offtakes from EV, grid and defence primes to de-risk volumes.